Semiconductor Applications

Diamond Wire

Semiconductor - cropping applications

Wire diameter = .310 mm

Semiconductor - wafering applications

Wire diameter = .140 mm

Key benefits when compared to slurry cutting:

50 - 80% faster cut times
Reduced cost of ownership
Reduced subsurface damage
Improved bow values
Comparable Ra values
Comparable warp values

Silicon Wafers

Recommended consumables

Diamond Wire Material Technologies offers a range of consumable products to support and enhance your diamond wire cutting process. The following consumable products are recommended for optimal results:

Diamond Wire:
- cropping applications = .310 mm wire
- wafering applications = .140 mm wire
WaferKool 2010 cutting fluid

Recommended Spools

Cropping Applications:

6" spools
BG60 Spools - bulk shipping
(requires on-site winding to your saw manufacturers machine spools)

Wafering Applications:

MB80
TA100
(De-spool on machine or on-site winding to your saw manufacturer's spool)

All DMT wire spools are specially packaged to meet domestic and international shipping requirements. Our primary goal is to package and ship materials as needed to ensure safe and effective transport from origin to destination.

DMT has worked with numerous packaging suppliers and packaging types and has been able to define several outstanding packaging methods to meet the needs of our external customers.