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PV Wafering
Silicon Cutting
Sapphire
Product Information

Sapphire Wafering

DMT's diamond wire cutting technology, and related products, will optimize your sapphire cutting processes and deliver outstanding results.

Sapphire wafering - wire diameter:

  • Diameter = .200 mm or .250 mm

Key benefits:

  • Fast cut times
  • Reduced cost of ownership
  • Reduced subsurface damage
  • Improved bow values
  • Excellent Ra values
  • Superior warp values

factsheet:
diamond wire for sapphire and Opto-electronic applications

DW - Sapphire & Opto-Electronics (.pdf, 517.2Kb)
  Recommended spools
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Recommended spools

  • BG60 - for bulk shipments
    (On-site winding to your saw manufacturers machine spools)
  • TA32
    (de-spool on machine or on-site winding to saw manufacturer's spool)
  • Super Saw Spool - for use with DMT's RTD 6400 / 6800
  • Custom winding to your saw manufacturer's spool

All DMT wire spools are specially packaged to meet domestic and international shipping requirements. Our primary goal is to package and ship materials as needed to ensure safe and effective transport from origin to destination.

DMT has worked with numerous packaging suppliers and packaging types and has been able to define several outstanding packaging methods to meet the needs of our external customers.

BG60 spool

BG60 12-Pack Crate: Inner detail / Final assembly

TA32 Spool

Super Saw Spool

  Recommended consumables
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Recommended consumables

Diamond Wire Material Technologies offers a range of consumable products to support and enhance your diamond wire cutting process. The following consumable products are recommended for optimal results:

  • Diamond wire: .200 mm or .250 mm
  • WaferKool 2010 cutting fluids
  • Epoxy Adhesives
  • Sacraficial Cutting Beams
  • Wire Guides and Pulleys
print/drucken

Meyer Burger Technology Group