Wafering - wire diameter

• Diameter = .140 mm

Key benefits

Faster speed rates 

• 2 x faster then slurry on average
• Increased capacity without increasing capital expenditures
• Faster ROI due to reduced initial capital investment
• Higher machine productivity

Roadmap to lower cost/watt

• Lower cost/watt resulting from reduced total cost of ownership
• Less expensive secondary process costs
• Re-use of wire
• Reduced utilities
• Flatter wafers

Less plant complexity

• No slurry mixing or supply and recovery systems required
• Reduced running costs such as electricity of cooling water
• Potential silicon kerf recycling

Flexibility and support

• Diamond wire works on Meyer Burger saws and other saw platforms
• Meyer Burger upgrade kits available
• Start-up kits available
• On-site process support provided