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Diamond Wire
A technology leap
for cutting applications

Diamond Wire Cutting Technology

Diamond Wire Material Technologies (DMT) serves the Solar (photovoltaic), Optical and Semiconductor markets around the world. We develop, manufacture and sell diamond wire, cutting fluids and cutting beams. Diamond wire cutting technology is an ideal choice for numerous hard-material cutting applications which includes silicon wafer slicing, bricking, cropping and squaring, sapphire wafer cutting, filament cutting and more.

DMT brings technical expertise and extensive application competence in the development, production and performance of diamond wire products. Diamond Wire Material Technologies focuses on lowering cost of ownership and increasing process yield.

Diamond Wire Material Technologies is a member of the technology company Meyer Burger. You will find all product offerings on www.meyerburger.com.

 

 

 

News / Events

17.05.2016 / Commercial

Meyer Burger’s DW288 Series 3 diamond wire cutting solution selected as PV Magazine’s 2016 Technology Highlight award winner. MORE

07.06.2016 - 09.06.2016

OPTATEC MORE

22.06.2016 - 24.06.2016

Intersolar Europe MORE

SmartWire Connection Technology

Significantly lowers photovoltaic production costs. MORE