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Diamond Wire
A technology leap
for cutting applications

Diamond Wire Cutting Technology

Diamond Wire Material Technologies (DMT) serves the Solar (photovoltaic), Optical and Semiconductor markets around the world. We develop, manufacture and sell diamond wire, cutting fluids and cutting beams. Diamond wire cutting technology is an ideal choice for numerous hard-material cutting applications which includes silicon wafer slicing, bricking, cropping and squaring, sapphire wafer cutting, filament cutting and more.

DMT brings technical expertise and extensive application competence in the development, production and performance of diamond wire products. Diamond Wire Material Technologies focuses on lowering cost of ownership and increasing process yield.

Diamond Wire Material Technologies is a member of the technology company Meyer Burger. You will find all product offerings on www.meyerburger.com.

 

 

 

News / Events

28.01.2016 / Ad Hoc

Meyer Burger receives two important contracts valued at over CHF 22 million, releases unaudited key financial data for fiscal year 2015 MORE

16.02.2016 - 18.02.2016

Photonics West MORE

15.03.2016 - 17.03.2016

Semicon China MORE

SmartWire Connection Technology

Significantly lowers photovoltaic production costs. MORE