header Home DMT
Diamond Wire
A technology leap
for cutting applications

Diamond Wire Cutting Technology

Diamond Wire Material Technologies (DMT) serves the Solar (photovoltaic), Optical and Semiconductor markets around the world. We develop, manufacture and sell diamond wire, cutting fluids and cutting beams. Diamond wire cutting technology is an ideal choice for numerous hard-material cutting applications which includes silicon wafer slicing, bricking, cropping and squaring, sapphire wafer cutting, filament cutting and more.

DMT brings technical expertise and extensive application competence in the development, production and performance of diamond wire products. Diamond Wire Material Technologies focuses on lowering cost of ownership and increasing process yield.

Diamond Wire Material Technologies is a member of Meyer Burger Technology Ltd. You will find all product offerings on the group website meyerburger.com.




News / Events

16.09.2015 / Commercial

PCB TOUCH cell contacting solution from Meyer Burger wins the Solar Industry Award 2015 in the category “Industry Development Award” MORE

16.02.2016 - 18.02.2016

Photonics West, San Francisco MORE

23.05.2016 - 25.05.2016


SmartWire Connection Technology

Significantly lowers photovoltaic production costs. MORE