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Diamond Wire
A technology leap
for cutting applications

Diamond Wire Cutting Technology

Diamond Wire Material Technologies (DMT) serves the Solar (photovoltaic), Optical and Semiconductor markets around the world. We develop, manufacture and sell diamond wire, cutting fluids and cutting beams. Diamond wire cutting technology is an ideal choice for numerous hard-material cutting applications which includes silicon wafer slicing, bricking, cropping and squaring, sapphire wafer cutting, filament cutting and more.

DMT brings technical expertise and extensive application competence in the development, production and performance of diamond wire products. Diamond Wire Material Technologies focuses on lowering cost of ownership and increasing process yield.

Diamond Wire Material Technologies is a member of Meyer Burger Technology Ltd. You will find all product offerings on the group website meyerburger.com.

 

 

 

News / Events

28.05.2015 / Commercial

The Fraunhofer Institute FEP in Dresden appoints Dr Margit Sarstedt, Managing Director of Meyer Burger’s MicroSystems business unit, to its Board of Trustees. MORE

10.06.2015 - 12.06.2015

Intersolar Europe, Munich MORE

14.07.2015 - 16.07.2015

Semicon West, San Francisco MORE

SmartWire Connection Technology

Significantly lowers photovoltaic production costs. MORE