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Diamond Wire -
A technology leap
for cutting applications

Diamond Wire Cutting Technology

Diamond Wire Material Technologies (DMT) serves the Solar (photovoltaic), Optical and Semiconductor markets around the world. We develop, manufacture and sell diamond wire, cutting fluids and cutting beams. Diamond wire cutting technology is an ideal choice for numerous hard-material cutting applications which includes silicon wafer slicing, bricking, cropping and squaring, sapphire wafer cutting, filament cutting and more.

DMT, as a member of Meyer Burger Group, brings technical expertise and extensive application competence in the development, production and performance of diamond wire products. Diamond Wire Material Technologies focuses on lowering cost of ownership and increasing process yield.

News / Events

21.05.2013 / Commercial

Meyer Burger’s dedicated measurement technology for high efficiency solar modules successfully approved by PI-Berlin MORE

05.06.2013 - 08.06.2013

Delhi International Renewable Energy Conference (DIREC), New Dehli, India  MORE

19.06.2013 - 21.06.2013

Intersolar Europe, München MORE

Highlights