Diamond Wire -
A technology leapfor cutting applications
for cutting applications
Diamond Wire Material Technologies (DMT) serves the Solar (photovoltaic), Optical and Semiconductor markets around the world. We develop, manufacture and sell diamond wire, cutting fluids and cutting beams. Diamond wire cutting technology is an ideal choice for numerous hard-material cutting applications to include: silicon wafer slicing, bricking, cropping and squaring, sapphire wafer cutting, filament cutting and more.
A member of Meyer Burger Group - DMT brings technical expertise, and extensive application competence, in the development, production and performance of diamond wire products aimed at lowering cost of ownership and increasing process yield
DMT is an industry leader in diamond wire slicing technology and products aimed at optimizing your PV Wafering processes for sillicon wafer production. MORE
Bricking, Cropping, Filament Cutting and Semiconductor applications realize many key benefits when using our diamond wire cutting technology and related products. MORE
