header Home DMT
Diamond Wire
A technology leap
for cutting applications

Diamond Wire Cutting Technology

Diamond Wire Material Technologies (DMT) serves the Solar (photovoltaic), Optical and Semiconductor markets around the world. We develop, manufacture and sell diamond wire, cutting fluids and cutting beams. Diamond wire cutting technology is an ideal choice for numerous hard-material cutting applications which includes silicon wafer slicing, bricking, cropping and squaring, sapphire wafer cutting, filament cutting and more.

DMT brings technical expertise and extensive application competence in the development, production and performance of diamond wire products. Diamond Wire Material Technologies focuses on lowering cost of ownership and increasing process yield.

Diamond Wire Material Technologies is a member of Meyer Burger Technology Ltd. You will find all product offerings on the group website meyerburger.com.

 

 

 

News / Events

09.04.2015 / Ad Hoc

Meyer Burger enters into strategic collaboration with leading French research centre CEA and receives order of over CHF 12 million in PV equipment. Meyer Burger and CEA will carry out joint research o MORE

28.04.2015 - 30.04.2015

SNEC PV Power Expo, Shanghai MORE

10.06.2015 - 12.06.2015

Intersolar Europe, Munich MORE

SmartWire Connection Technology

Significantly lowers photovoltaic production costs. MORE